Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review
Publication date | 2000 |
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Host publication | Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International |
Place of Publication | New York |
Publisher | IEEE |
Pages | 96-98 |
Number of pages | 3 |
ISBN (print) | 0-7803-6327-2 |
<mark>Original language</mark> | English |
Event | 3rd Annual International Interconnect Technology Conference - SAN FRANCISCO Duration: 5/06/2000 → 7/06/2000 |
Conference | 3rd Annual International Interconnect Technology Conference |
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City | SAN FRANCISCO |
Period | 5/06/00 → 7/06/00 |
Conference | 3rd Annual International Interconnect Technology Conference |
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City | SAN FRANCISCO |
Period | 5/06/00 → 7/06/00 |
A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution less than or equal to 10 nm. This technique reveals a RIE-induced hardening of the low-k polymer at the metal/polymer interface and offers new opportunities for metrological reliability evaluation of low-k integration processes.