Final published version
Licence: CC BY: Creative Commons Attribution 4.0 International License
Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
}
TY - JOUR
T1 - On-chip quantum confinement refrigeration overcoming electron-phonon heat leaks
AU - Autti, S.
AU - Prance, J. R.
AU - Prunnila, M.
PY - 2025/4/15
Y1 - 2025/4/15
N2 - Circuit-based quantum devices rely on keeping electrons at millikelvin temperatures. Improved coherence and sensitivity as well as discovering new physical phenomena motivate pursuing ever lower electron temperatures, accessible using on-chip cooling techniques. Here we show that a two-dimensional electron gas (2DEG), with the sub-band populations manipulated using gate voltages, works as an on-chip cooler only limited by a fundamental phonon heat leak. The 2DEG can, for example, be realized in a silicon-based double-gate complementary metal oxide semiconductor (CMOS) transistor. A single-shot 2DEG cooler can reduce the electron temperature by a factor of 2 with a hold time up to a second, achieved by expanding the electron gas into an additional sub-band. Integrating an array of such coolers—using, e.g., CMOS fabrication techniques—to obtain continuous cooldown may allow reaching down to microkelvin device temperatures.
AB - Circuit-based quantum devices rely on keeping electrons at millikelvin temperatures. Improved coherence and sensitivity as well as discovering new physical phenomena motivate pursuing ever lower electron temperatures, accessible using on-chip cooling techniques. Here we show that a two-dimensional electron gas (2DEG), with the sub-band populations manipulated using gate voltages, works as an on-chip cooler only limited by a fundamental phonon heat leak. The 2DEG can, for example, be realized in a silicon-based double-gate complementary metal oxide semiconductor (CMOS) transistor. A single-shot 2DEG cooler can reduce the electron temperature by a factor of 2 with a hold time up to a second, achieved by expanding the electron gas into an additional sub-band. Integrating an array of such coolers—using, e.g., CMOS fabrication techniques—to obtain continuous cooldown may allow reaching down to microkelvin device temperatures.
U2 - 10.1103/physrevb.111.l161404
DO - 10.1103/physrevb.111.l161404
M3 - Journal article
VL - 111
JO - Physical Review B
JF - Physical Review B
SN - 2469-9950
IS - 16
M1 - L161404
ER -