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Optimising bandwidth over deep sub-micron interconnect.

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Publication date2002
Host publication2002 IEEE International Symposium on Circuits and Systems
PublisherIEEE
PagesIV-193
Volume4
ISBN (Print)0-7803-7448-7
<mark>Original language</mark>English

Abstract

In deep sub-micron (DSM) circuits proper analysis of interconnect delay is very important. When relatively long wires are placed in parallel, it is essential to include the effects of cross-talk on delay. In a parallel wire structure, the exact spacing and size of the wires determine both the resistance and the distribution of the capacitance between the ground plane and the adjacent signal carrying conductors, and have a direct effect on the delay. Repeater insertion depending on whether it is optimal or constrained, affects the delay in different ways. Considering all these effects we show that there is a clear optimum configuration for the wires which maximises the total bandwidth. Our analysis is valid for lossy interconnects as are typical of wires in DSM technologies.

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