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Printed circuit board as a MEMS platform for focused ion beam technology

Research output: Contribution to Journal/MagazineJournal articlepeer-review

  • D. Cheneler
  • J. Teng
  • M. Adams
  • C. J. Anthony
  • E. L. Carter
  • M. Ward
<mark>Journal publication date</mark>01/2011
<mark>Journal</mark>Microelectronic Engineering
Issue number1
Number of pages6
Pages (from-to)121-126
Publication StatusPublished
<mark>Original language</mark>English


By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics.