Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
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TY - JOUR
T1 - Printed circuit board as a MEMS platform for focused ion beam technology
AU - Cheneler, D.
AU - Teng, J.
AU - Adams, M.
AU - Anthony, C. J.
AU - Carter, E. L.
AU - Ward, M.
PY - 2011/1
Y1 - 2011/1
N2 - By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics.
AB - By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics.
KW - Focused ion beam
KW - Printed circuit board
KW - Thermal sensor
U2 - 10.1016/j.mee.2010.09.017
DO - 10.1016/j.mee.2010.09.017
M3 - Journal article
VL - 88
SP - 121
EP - 126
JO - Microelectronic Engineering
JF - Microelectronic Engineering
SN - 0167-9317
IS - 1
ER -