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The nanoporous metallisation of insulating substrates through Photocatalytically Initiated Electroless Deposition (PIED)

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Article numbermrsf11-1409-cc05-20
<mark>Journal publication date</mark>22/03/2012
<mark>Journal</mark>MRS Online Proceedings Library
Number of pages6
Publication StatusPublished
Early online date1/03/12
<mark>Original language</mark>English
Event2011 MRS Fall Meeting - Boston, United States
Duration: 28/11/20112/12/2011


Conference2011 MRS Fall Meeting
Country/TerritoryUnited States


We report the novel use of semiconductor photocatalysis for the deposition of metal onto insulating surfaces and the in-process formation of nano-structured porosity within this metal. In the process of Photocatalytically Initiated Electroless Deposition (PIED) we have developed a controllable, spatially selective and versatile metallisation technique with several advantages over traditional, non-photocatalytic techniques such as enhanced controllability and purity of the deposit as well as reduced operational costs and environmental impact. With the addition of a self-assembled, hexagonally close-packed microparticle template to the substrate prior to metal deposition, PIED can be used to fabricate thin metal films with highly ordered porosity on the nano-scale. Nanoporous metallisation in this way is able to produce substrates with potentially wide applications such as membrane and separation technology, energy storage and sensors – especially surface enhanced resonance Raman spectroscopy (SERRS).