Rights statement: This is the author’s version of a work that was accepted for publication in Polymer Degradation and Stability. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Polymer Degradation and Stability, 160, 2018 DOI: 10.1016/j.polymdegradstab.2018.12.030
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Final published version
Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
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TY - JOUR
T1 - The stability and degradation of PECVD fluoropolymer nanofilms
AU - Bowen, James
AU - Cheneler, David
N1 - This is the author’s version of a work that was accepted for publication in Polymer Degradation and Stability. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Polymer Degradation and Stability, 160, 2018 DOI: 10.1016/j.polymdegradstab.2018.12.030
PY - 2019/2
Y1 - 2019/2
N2 - Fluoropolymer films are frequently used in microfabrication and for producing hydrophobic and low-k dielectric layers in various applications. As the reliability of functional coatings is becoming a more pressing issue in industry, it is necessary to determine the physical stability and degradation properties of this important class of films. To this end, a study has been undertaken to ascertain the aging characteristics of fluoropolymer films under various environmental conditions that such a film may experience during its use. In particular, fluorocarbon films formed by plasma-enhanced chemical vapour deposition (PECVD) using octafluorocyclobutane, or c-C4F8, as a precursor gas have been exposed to abrasive wear, elevated temperatures, ultraviolet radiation, as well as oxygen plasma and SF6 plasma, the latter being commonly used in conjunction with these films in ion etching processes. The results show that sub-micron thick fluoropolymer films exhibit a significant amount of elastic recovery during nanoscratch tests, minimising the impact of wear. The films exhibit stability when exposed to 365 nm UV light in air, but not 254 nm light in air, which generated significant decreases in thickness. Exposure to temperatures up to 175 °C did not generate loss of material, whereas temperatures higher than 175 °C did. Etching rates upon exposure to oxygen and SF6 plasmas were also measured.
AB - Fluoropolymer films are frequently used in microfabrication and for producing hydrophobic and low-k dielectric layers in various applications. As the reliability of functional coatings is becoming a more pressing issue in industry, it is necessary to determine the physical stability and degradation properties of this important class of films. To this end, a study has been undertaken to ascertain the aging characteristics of fluoropolymer films under various environmental conditions that such a film may experience during its use. In particular, fluorocarbon films formed by plasma-enhanced chemical vapour deposition (PECVD) using octafluorocyclobutane, or c-C4F8, as a precursor gas have been exposed to abrasive wear, elevated temperatures, ultraviolet radiation, as well as oxygen plasma and SF6 plasma, the latter being commonly used in conjunction with these films in ion etching processes. The results show that sub-micron thick fluoropolymer films exhibit a significant amount of elastic recovery during nanoscratch tests, minimising the impact of wear. The films exhibit stability when exposed to 365 nm UV light in air, but not 254 nm light in air, which generated significant decreases in thickness. Exposure to temperatures up to 175 °C did not generate loss of material, whereas temperatures higher than 175 °C did. Etching rates upon exposure to oxygen and SF6 plasmas were also measured.
KW - Octafluorocyclobutane
KW - Plasma deposition
KW - Atomic force microscopy
KW - Wear
KW - Ellipsometry
U2 - 10.1016/j.polymdegradstab.2018.12.030
DO - 10.1016/j.polymdegradstab.2018.12.030
M3 - Journal article
VL - 160
SP - 203
EP - 209
JO - Polymer Degradation and Stability
JF - Polymer Degradation and Stability
SN - 0141-3910
ER -