Home > Research > Engineering > Publications & Outputs
View graph of relations
  1. Chapter
  2. Published

    An on-line monitoring technique for electrode degradation in bio-fluidic microsystems.

    Al-Gayem, Q., Liu, H., Richardson, A. M. D., Burd, N. & Kumar, M., 10/2010, Proceedings of the 2010 IEEE International Test Conference (ITC). Austin, Texas: IEEE, p. 1-10 10 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  3. Published

    Laser direct metal deposition: theory and applications in manufacturing and maintenance

    Pinkerton, A. J., 2010, Advances in laser materials processing : technology, research and applications. Lawrence, J. (ed.). Oxford: Woodhead Publishing Limited

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  4. Published

    Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.

    Weerasekera, R., Grange, M., Pamunuwa, D. B., Tenhunen, H. & Zheng, L-R., 10/2009, Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  5. Published

    Scalability of Network-on-Chip communication architecture for 3-D meshes.

    Weldezion, A. Y., Grange, M., Pamunuwa, D. B., Lu, Z., Jantsch, A., Weerasekera, R. & Tenhunen, H., 12/06/2009, Proc. ACM/IEEE International Symposium on Networks on Chip (NOCS). San Diego: IEEE, p. 114-123 10 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  6. Published

    Conceptual design of a 1MW 175MHz CW magnetron.

    Carter, R. G., 04/2009, 2009 IEEE International Vacuum Electronics Conference. Piscataway, NJ, USA: IEEE, 566 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  7. Published

    Simple model of an inductive output tube.

    Carter, R. G., 04/2009, 2009 IEEE International Vacuum Electronics Conference. Piscataway, NJ, USA: IEEE, p. 427-428 2 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  8. Published

    Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs).

    Weerasekera, R., Pamunuwa, D. B., Grange, M., Tenhunen, H. & Zheng, L-R., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  9. Published

    Exploration of Through Silicon Via Interconnect Parasitics for 3-Dimensional Integrated Circuits

    Grange, M., Weerasekera, R., Pamunuwa, D. & Tenhunen, H., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  10. Published

    Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits.

    Weldezion, A., Weerasekera, R., Pamunuwa, D. B., Zheng, L-R. & Tenhunen, H., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

  11. Published

    Physical Mapping and Performance Study of a Multi-Clock 3-Dimensional Network-on-Chip Mesh.

    Grange, M., Weldezion, A. Y., Pamunuwa, D. B., Weerasekera, R., Zhonghai, L., Jantsch, A. & Shippen, D., 2009, Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Previous 1...4 5 6 7 8 9 10 11 ...524 Next

Back to top