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conf9_3DIC_2009.pdf
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Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

Published

A. Weldezion
Roshan Weerasekera
Danesh B. Pamunuwa
Li-Rong Zheng
Hannu Tenhunen

Publication date	2009
Host publication	Workshop Notes, Design, Automation and Test in Europe (DATE)
Place of Publication	Nice
<mark>Original language</mark>	English