Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs). - Research Portal | Lancaster University

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Closed-form equations for through-silicon via (TSV) parasitics in 3-D integrated circuits (ICs).

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

Published

Roshan Weerasekera
Dinesh B. Pamunuwa
M. Grange
Hannu Tenhunen
Li-Rong Zheng

Publication date	2009
Host publication	Workshop Notes, Design, Automation and Test in Europe (DATE)
Place of Publication	Nice
<mark>Original language</mark>	English