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Electronic cooling of a submicron-sized metallic beam

Research output: Contribution to journalJournal articlepeer-review

  • J. T. Muhonen
  • A. O. Niskanen
  • M. Meschke
  • Yuri Pashkin
  • J. S. Tsai
  • L. Sainiemi
  • S. Franssila
  • J. P. Pekola
Article number073101
<mark>Journal publication date</mark>16/02/2009
<mark>Journal</mark>Applied Physics Letters
Issue number7
Number of pages3
Pages (from-to)-
Publication StatusPublished
<mark>Original language</mark>English


We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.