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Electronic cooling of a submicron-sized metallic beam

Research output: Contribution to Journal/Magazine › Journal article › peer-review

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Electronic cooling of a submicron-sized metallic beam. / Muhonen, J. T.; Niskanen, A. O.; Meschke, M. et al.
In: Applied Physics Letters, Vol. 94, No. 7, 073101, 16.02.2009, p. -.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Muhonen, JT, Niskanen, AO, Meschke, M, Pashkin, Y, Tsai, JS, Sainiemi, L, Franssila, S & Pekola, JP 2009, 'Electronic cooling of a submicron-sized metallic beam', Applied Physics Letters, vol. 94, no. 7, 073101, pp. -. https://doi.org/10.1063/1.3080668

APA

Muhonen, J. T., Niskanen, A. O., Meschke, M., Pashkin, Y., Tsai, J. S., Sainiemi, L., Franssila, S., & Pekola, J. P. (2009). Electronic cooling of a submicron-sized metallic beam. Applied Physics Letters, 94(7), -. Article 073101. https://doi.org/10.1063/1.3080668

Vancouver

Muhonen JT, Niskanen AO, Meschke M, Pashkin Y, Tsai JS, Sainiemi L et al. Electronic cooling of a submicron-sized metallic beam. Applied Physics Letters. 2009 Feb 16;94(7):-. 073101. doi: 10.1063/1.3080668

Author

Muhonen, J. T. ; Niskanen, A. O. ; Meschke, M. et al. / Electronic cooling of a submicron-sized metallic beam. In: Applied Physics Letters. 2009 ; Vol. 94, No. 7. pp. -.

Bibtex

@article{d5302c57d5c549048dbbf697b22beb57,
title = "Electronic cooling of a submicron-sized metallic beam",
abstract = "We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.",
author = "Muhonen, {J. T.} and Niskanen, {A. O.} and M. Meschke and Yuri Pashkin and Tsai, {J. S.} and L. Sainiemi and S. Franssila and Pekola, {J. P.}",
year = "2009",
month = feb,
day = "16",
doi = "10.1063/1.3080668",
language = "English",
volume = "94",
pages = "--",
journal = "Applied Physics Letters",
issn = "0003-6951",
publisher = "American Institute of Physics Inc.",
number = "7",

}

RIS

TY - JOUR

T1 - Electronic cooling of a submicron-sized metallic beam

AU - Muhonen, J. T.

AU - Niskanen, A. O.

AU - Meschke, M.

AU - Pashkin, Yuri

AU - Tsai, J. S.

AU - Sainiemi, L.

AU - Franssila, S.

AU - Pekola, J. P.

PY - 2009/2/16

Y1 - 2009/2/16

N2 - We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.

AB - We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.

U2 - 10.1063/1.3080668

DO - 10.1063/1.3080668

M3 - Journal article

VL - 94

SP - -

JO - Applied Physics Letters

JF - Applied Physics Letters

SN - 0003-6951

IS - 7

M1 - 073101

ER -