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Guidance on Thickness Design for Wide-Bandgap Semiconductor Thermal Neutron Detectors with Layered Structure and Research on Their Microscopic Radiation Resistance

Research output: ThesisDoctoral Thesis

Published
Publication date2024
Number of pages173
QualificationPhD
Awarding Institution
Supervisors/Advisors
Publisher
  • Lancaster University
<mark>Original language</mark>English

Abstract

In semiconductor neutron detectors with a layered structure, the fundamental
structure consists of a converter layer and a semiconductor layer. It has been shown in research focused on these detectors that the thicknesses of both the converter and semiconductor layers crucially impact the efficiency of neutron detection.

However, there is a notable scarcity of studies that determine the optimal
thickness of the converter layer and the corresponding optimal thickness of the
semiconductor layer, especially using direct theoretical formulas for the efficiency of the converter layer. This lack of research is particularly evident for wide-bandgap semiconductor materials such as diamond, silicon carbide (SiC), gallium oxide (Ga2O3), gallium nitride (GaN), and the perovskite material caesium lead bromide (CsPbBr3).

Herein, on the basis of theoretical studies about the efficiency of layered semiconductor detectors, a systematic method has been proposed for calculating the optimal thicknesses for two types of converter layers. This method has been implemented in computational software. By inputting the macroscopic cross-section