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High Performance Printed Electronics on Large Area Flexible Substrates

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNConference contribution/Paperpeer-review

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  • Mahesh Soni
  • Dhayalan Shakthivel
  • Adamos Christou
  • Ayoub Zumeit
  • NIvasan Yogeswaran
  • Ravinder Dahiya
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Publication date16/06/2020
Host publication2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
PublisherIEEE
Number of pages4
ISBN (electronic)9781728125398
ISBN (print)9781728125404
<mark>Original language</mark>English
EventIEEE Electron Devices Technology and Manufacturing (EDTM) conference - Penang, Malaysia, Penang, Malaysia
Duration: 6/04/2020 → …
Conference number: 4
https://ewh.ieee.org/conf/edtm/2020/

Conference

ConferenceIEEE Electron Devices Technology and Manufacturing (EDTM) conference
Abbreviated titleEDTM
Country/TerritoryMalaysia
CityPenang
Period6/04/20 → …
Internet address

Conference

ConferenceIEEE Electron Devices Technology and Manufacturing (EDTM) conference
Abbreviated titleEDTM
Country/TerritoryMalaysia
CityPenang
Period6/04/20 → …
Internet address

Abstract

Printed electronics has attracted significant interest in recent years due to simple, cost-effective fabrication, reduced e-waste and potential for the development of multifunctional devices over large areas. Over the years, various printing technologies have been developed to pattern flexible surfaces to develop wide range of electronic devices. A large part of the research so far has focussed on organic semiconductors based devices, even if the modest performance they offer is insufficient for several emerging applications (e. g. internet of things (IoTs), smart cities, robotics, etc.) where fast computation and communication are required. The high-performance requirements could be addressed with printed devices from high-mobility materials such as single crystal silicon (Si) and graphene. This paper presents the printing methodologies (i.e. contact and transfer printing) that are being explored for highperformance devices and circuits using nano to macro scale structures such as semiconductor nanowires (NWs), nanoribbon (NR), and ultra-thin chips (UTCs) as well as graphene. Few examples of high-performance devices obtained using contact and transfer printing are also presented.

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©2020 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.