TY - JOUR

T1 - Recent progress of laser processing technology in micro-LED display manufacturing

T2 - A review

AU - Song, L.

AU - Yong, X.

AU - Zhang, P.

AU - Song, S.

AU - Chen, K.

AU - Yan, H.

AU - Sun, T.

AU - Lu, Q.

AU - Shi, H.

AU - Chen, Y.

AU - Huang, Y.

PY - 2025/2/28

Y1 - 2025/2/28

N2 - Micro-LED undoubtedly stands out as a highly anticipated technology when it comes to the innovation of future display technologies. Micro-LED technology surpasses traditional display technologies regarding color representation, energy efficiency, and flexibility by individually assembling tiny light-emitting diodes on a substrate. Micro-LED technology, a further evolution of LED, is considered the most promising next-generation display technology due to its outstanding brightness, high contrast ratio, and extremely high pixel density. The application of laser technology in Micro-LED displays is increasingly becoming a focus of research and industry. As a highly integrated light source, lasers offer unique advantages in Micro-LED applications, including high-energy density processing, non-contact processing, precise microstructure processing and sculpting capability, efficient packaging, and improved device quality and reliability. These advantages provide a distinctive edge in achieving high-precision manufacturing and assembly of Micro-LED chips. Laser epitaxy substrate technology utilizes laser heating and material deposition to grow Micro-LED chips on a substrate. Laser etching technology achieves precise control of lasers to enable microstructure processing and sculpting of Micro-LED devices. Laser lift-off technology utilizes laser-induced decomposition of GaN to peel off the underlying material, allowing for the separation of Micro-LEDs. Laser-based massive transfer technology uses the energy of lasers to swiftly and accurately transfer Micro-LEDs from the substrate to the target substrate, enabling rapid device transfer. Lastly, laser repair technology is employed for the detection and repair of potential defects in Micro-LEDs, enhancing device quality and reliability. By utilizing lasers, we can expect to achieve higher production efficiency, more precise device manufacturing, and superior optoelectronic performance in the field of Micro-LED, thereby presenting broader prospects for future display technology and lighting applications. These laser technologies provide new solutions for Micro-LED devices’ high-precision and high-efficiency production.

AB - Micro-LED undoubtedly stands out as a highly anticipated technology when it comes to the innovation of future display technologies. Micro-LED technology surpasses traditional display technologies regarding color representation, energy efficiency, and flexibility by individually assembling tiny light-emitting diodes on a substrate. Micro-LED technology, a further evolution of LED, is considered the most promising next-generation display technology due to its outstanding brightness, high contrast ratio, and extremely high pixel density. The application of laser technology in Micro-LED displays is increasingly becoming a focus of research and industry. As a highly integrated light source, lasers offer unique advantages in Micro-LED applications, including high-energy density processing, non-contact processing, precise microstructure processing and sculpting capability, efficient packaging, and improved device quality and reliability. These advantages provide a distinctive edge in achieving high-precision manufacturing and assembly of Micro-LED chips. Laser epitaxy substrate technology utilizes laser heating and material deposition to grow Micro-LED chips on a substrate. Laser etching technology achieves precise control of lasers to enable microstructure processing and sculpting of Micro-LED devices. Laser lift-off technology utilizes laser-induced decomposition of GaN to peel off the underlying material, allowing for the separation of Micro-LEDs. Laser-based massive transfer technology uses the energy of lasers to swiftly and accurately transfer Micro-LEDs from the substrate to the target substrate, enabling rapid device transfer. Lastly, laser repair technology is employed for the detection and repair of potential defects in Micro-LEDs, enhancing device quality and reliability. By utilizing lasers, we can expect to achieve higher production efficiency, more precise device manufacturing, and superior optoelectronic performance in the field of Micro-LED, thereby presenting broader prospects for future display technology and lighting applications. These laser technologies provide new solutions for Micro-LED devices’ high-precision and high-efficiency production.

U2 - 10.1016/j.optlastec.2024.111710

DO - 10.1016/j.optlastec.2024.111710

M3 - Journal article

VL - 181

JO - Optics and Laser Technology

JF - Optics and Laser Technology

SN - 0030-3992

M1 - 111710

ER -