The ATLAS inner detector will be completely replaced to cope with the increased occupancy and radiation damage that will be posed by the High Luminosity phase of the Large Hadron Collider. The new all-silicon Inner Tracker will consist of pixel sensors in the innermost part. They will be realized using different silicon sensor technologies and will be read out with ITkPixV2 ASICs. Their connection is realized by bump bonding. n-in-p planar hybrid modules 100 µm and 150 µm thick will instrument the four outer layers of the pixel detector. Due to their radiation hardness, 3D sensors will be installed in the innermost layer, where a fluence up to 2.0 × 1016 neq/cm2 is expected. Their production is distributed among different vendors, and the pre-production sensors from each vendor are progressively being tested before and after irradiation with test beams. The most recent results will be presented here.