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Recent test beam results of ATLAS ITk pixel modules

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Recent test beam results of ATLAS ITk pixel modules. / Samy, Md Arif Abdulla; Calderini, G.; Carcone, T.I. et al.
In: Journal of Instrumentation, Vol. 20, No. 06, C06025, 30.06.2025.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Samy, MAA, Calderini, G, Carcone, TI, Carlotto, JI, Chabrillat, P, Gemme, C, Grigorev, A, Heim, T, Meng, L, Miranova, M, Ravera, S, Ressegotti, M, Rummler, A, Skaf, A & Krause, C 2025, 'Recent test beam results of ATLAS ITk pixel modules', Journal of Instrumentation, vol. 20, no. 06, C06025. https://doi.org/10.1088/1748-0221/20/06/c06025

APA

Samy, M. A. A., Calderini, G., Carcone, T. I., Carlotto, J. I., Chabrillat, P., Gemme, C., Grigorev, A., Heim, T., Meng, L., Miranova, M., Ravera, S., Ressegotti, M., Rummler, A., Skaf, A., & Krause, C. (2025). Recent test beam results of ATLAS ITk pixel modules. Journal of Instrumentation, 20(06), Article C06025. https://doi.org/10.1088/1748-0221/20/06/c06025

Vancouver

Samy MAA, Calderini G, Carcone TI, Carlotto JI, Chabrillat P, Gemme C et al. Recent test beam results of ATLAS ITk pixel modules. Journal of Instrumentation. 2025 Jun 30;20(06):C06025. Epub 2025 Jun 17. doi: 10.1088/1748-0221/20/06/c06025

Author

Samy, Md Arif Abdulla ; Calderini, G. ; Carcone, T.I. et al. / Recent test beam results of ATLAS ITk pixel modules. In: Journal of Instrumentation. 2025 ; Vol. 20, No. 06.

Bibtex

@article{33639ed356344f40a07d52e9b65096c2,
title = "Recent test beam results of ATLAS ITk pixel modules",
abstract = "The ATLAS inner detector will be completely replaced to cope with the increased occupancy and radiation damage that will be posed by the High Luminosity phase of the Large Hadron Collider. The new all-silicon Inner Tracker will consist of pixel sensors in the innermost part. They will be realized using different silicon sensor technologies and will be read out with ITkPixV2 ASICs. Their connection is realized by bump bonding. n-in-p planar hybrid modules 100 µm and 150 µm thick will instrument the four outer layers of the pixel detector. Due to their radiation hardness, 3D sensors will be installed in the innermost layer, where a fluence up to 2.0 × 1016 neq/cm2 is expected. Their production is distributed among different vendors, and the pre-production sensors from each vendor are progressively being tested before and after irradiation with test beams. The most recent results will be presented here.",
keywords = "Radiation-hard detectors, Hybrid detectors, Beam-line instrumentation (beam position and profile monitors, beam-intensity monitors, bunch length monitors)",
author = "Samy, {Md Arif Abdulla} and G. Calderini and T.I. Carcone and J.I. Carlotto and P. Chabrillat and C. Gemme and A. Grigorev and T. Heim and L. Meng and M. Miranova and S. Ravera and M. Ressegotti and A. Rummler and A. Skaf and C. Krause",
year = "2025",
month = jun,
day = "30",
doi = "10.1088/1748-0221/20/06/c06025",
language = "English",
volume = "20",
journal = "Journal of Instrumentation",
issn = "1748-0221",
publisher = "Institute of Physics Publishing",
number = "06",

}

RIS

TY - JOUR

T1 - Recent test beam results of ATLAS ITk pixel modules

AU - Samy, Md Arif Abdulla

AU - Calderini, G.

AU - Carcone, T.I.

AU - Carlotto, J.I.

AU - Chabrillat, P.

AU - Gemme, C.

AU - Grigorev, A.

AU - Heim, T.

AU - Meng, L.

AU - Miranova, M.

AU - Ravera, S.

AU - Ressegotti, M.

AU - Rummler, A.

AU - Skaf, A.

AU - Krause, C.

PY - 2025/6/30

Y1 - 2025/6/30

N2 - The ATLAS inner detector will be completely replaced to cope with the increased occupancy and radiation damage that will be posed by the High Luminosity phase of the Large Hadron Collider. The new all-silicon Inner Tracker will consist of pixel sensors in the innermost part. They will be realized using different silicon sensor technologies and will be read out with ITkPixV2 ASICs. Their connection is realized by bump bonding. n-in-p planar hybrid modules 100 µm and 150 µm thick will instrument the four outer layers of the pixel detector. Due to their radiation hardness, 3D sensors will be installed in the innermost layer, where a fluence up to 2.0 × 1016 neq/cm2 is expected. Their production is distributed among different vendors, and the pre-production sensors from each vendor are progressively being tested before and after irradiation with test beams. The most recent results will be presented here.

AB - The ATLAS inner detector will be completely replaced to cope with the increased occupancy and radiation damage that will be posed by the High Luminosity phase of the Large Hadron Collider. The new all-silicon Inner Tracker will consist of pixel sensors in the innermost part. They will be realized using different silicon sensor technologies and will be read out with ITkPixV2 ASICs. Their connection is realized by bump bonding. n-in-p planar hybrid modules 100 µm and 150 µm thick will instrument the four outer layers of the pixel detector. Due to their radiation hardness, 3D sensors will be installed in the innermost layer, where a fluence up to 2.0 × 1016 neq/cm2 is expected. Their production is distributed among different vendors, and the pre-production sensors from each vendor are progressively being tested before and after irradiation with test beams. The most recent results will be presented here.

KW - Radiation-hard detectors

KW - Hybrid detectors

KW - Beam-line instrumentation (beam position and profile monitors, beam-intensity monitors, bunch length monitors)

U2 - 10.1088/1748-0221/20/06/c06025

DO - 10.1088/1748-0221/20/06/c06025

M3 - Journal article

VL - 20

JO - Journal of Instrumentation

JF - Journal of Instrumentation

SN - 1748-0221

IS - 06

M1 - C06025

ER -