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  • Platt et al. 2021: Thermal neutron absorption in printed circuit boards

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Thermal neutron absorption in printed circuit boards

Research output: Contribution to journalJournal articlepeer-review

Published
<mark>Journal publication date</mark>31/03/2021
<mark>Journal</mark>IEEE Transactions on Nuclear Science
Issue number4
Volume68
Number of pages7
Pages (from-to)463 - 469
Publication StatusPublished
Early online date24/02/21
<mark>Original language</mark>English

Abstract

Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm<sup>-1</sup>, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used.

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©2021 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.