Home > Research > Publications & Outputs > Thermal neutron absorption in printed circuit b...

Research

Associated organisational units

Electronic data

  • Platt et al. 2021: Thermal neutron absorption in printed circuit boards

    Rights statement: © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

    Accepted author manuscript, 395 KB, PDF document

    Available under license: CC BY-NC: Creative Commons Attribution-NonCommercial 4.0 International License

Links

Text available via DOI:

View graph of relations

Thermal neutron absorption in printed circuit boards

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Published

Standard

Thermal neutron absorption in printed circuit boards. / Platt, Simon; August, Shaun; MacLeod, Michael et al.
In: IEEE Transactions on Nuclear Science, Vol. 68, No. 4, 31.03.2021, p. 463 - 469.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Platt, S, August, S, MacLeod, M, Anderson, M, Cheneler, D & Monk, S 2021, 'Thermal neutron absorption in printed circuit boards', IEEE Transactions on Nuclear Science, vol. 68, no. 4, pp. 463 - 469. https://doi.org/10.1109/TNS.2021.3060864

APA

Platt, S., August, S., MacLeod, M., Anderson, M., Cheneler, D., & Monk, S. (2021). Thermal neutron absorption in printed circuit boards. IEEE Transactions on Nuclear Science, 68(4), 463 - 469. https://doi.org/10.1109/TNS.2021.3060864

Vancouver

Platt S, August S, MacLeod M, Anderson M, Cheneler D, Monk S. Thermal neutron absorption in printed circuit boards. IEEE Transactions on Nuclear Science. 2021 Mar 31;68(4):463 - 469. Epub 2021 Feb 24. doi: 10.1109/TNS.2021.3060864

Author

Platt, Simon ; August, Shaun ; MacLeod, Michael et al. / Thermal neutron absorption in printed circuit boards. In: IEEE Transactions on Nuclear Science. 2021 ; Vol. 68, No. 4. pp. 463 - 469.

Bibtex

@article{6d89e8b7f0b340ff9dca7acae1e79e38,
title = "Thermal neutron absorption in printed circuit boards",
abstract = "Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm-1, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used.",
author = "Simon Platt and Shaun August and Michael MacLeod and Mike Anderson and David Cheneler and Stephen Monk",
note = "{\textcopyright}2021 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. ",
year = "2021",
month = mar,
day = "31",
doi = "10.1109/TNS.2021.3060864",
language = "English",
volume = "68",
pages = "463 -- 469",
journal = "IEEE Transactions on Nuclear Science",
issn = "0018-9499",
publisher = "IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC",
number = "4",

}

RIS

TY - JOUR

T1 - Thermal neutron absorption in printed circuit boards

AU - Platt, Simon

AU - August, Shaun

AU - MacLeod, Michael

AU - Anderson, Mike

AU - Cheneler, David

AU - Monk, Stephen

N1 - ©2021 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

PY - 2021/3/31

Y1 - 2021/3/31

N2 - Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm-1, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used.

AB - Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm-1, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used.

U2 - 10.1109/TNS.2021.3060864

DO - 10.1109/TNS.2021.3060864

M3 - Journal article

VL - 68

SP - 463

EP - 469

JO - IEEE Transactions on Nuclear Science

JF - IEEE Transactions on Nuclear Science

SN - 0018-9499

IS - 4

ER -