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  1. Published

    Electrodeposition of indium bumps for ultrafine pitch interconnection

    Tian, Y., Liu, C., Hutt, D. & Stevens, B., 02/2014, In: Journal of Electronic Materials. 43, 2, p. 594-603 10 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  2. Published

    Fabrication of multilayered SU8 structure for terahertz waveguide with ultralow transmission loss

    Tian, Y., Shang, X. & Lancaster, M. J., 01/2014, In: Journal of Micro/Nanolithography, MEMS, and MOEMS. 13, 1, 6 p., 013002.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  3. Published

    High density indium bumping using electrodeposition enhanced by megasonic agitation

    Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2009, Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, p. 31-35 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  4. Published

    Megasonic enhanced wafer bumping process to enable high density electronics interconnection

    Tian, Y., Kaufmann, J., Liu, C., Hutt, D. A., Stevens, B. & Desmulliez, M. P. Y., 2008, Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. IEEE, p. 725-729 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  5. Published

    High density indium bumping through pulse plating used for pixel X-ray detectors

    Tian, Y., Hutt, D. A., Liu, C. & Stevens, B., 10/08/2009, Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. IEEE, p. 456-460 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  6. Published

    Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

    Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2011, Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, p. 739-744 6 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  7. Published

    A Review on Laser Powder Bed Fusion of Inconel 625 Nickel-Based Alloy

    Tian, Z., Zhang, C., Wang, D., Liu, W., Fang, X., Wellmann, D., Zhao, Y. & Tian, Y., 20/12/2019, In: Applied Sciences. 10, 1, 14 p., 81.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  8. Published

    Improved Model for Beam-Wave Interaction with Ohmic Losses and Reflections of Sheet Beam Traveling Wave Tubes

    Tian, H., Shi, N., Wang, Z., Wang, S., Duan, Z., Gong, H., Lu, Z., Paoloni, C., Feng, J. & Gong, Y., 30/06/2021, In: IEEE Transactions on Electron Devices. 68, 6, p. 2977-2983 7 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  9. Published

    A comparison of plutonium abundance in soil from sites in the United Kingdom measured with high-efficiency, high-resolution γ-ray spectroscopy, neutron assay and accelerator mass spectrometry

    Tighe, C., Christl, M., Degueldre, C., Andrew, J. & Joyce, M. J., 9/09/2018, Plutonium Futures: The Science 2018. San Diego: American Nuclear Society, p. 158-160 3 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  10. Published

    Bespoke analysis of soil in a high uranium background for identification of trace plutonium in decommissioning applications

    Tighe, C., 2020, Lancaster University: Lancaster University. 141 p.

    Research output: Thesis › Doctoral Thesis

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