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  1. Published

    On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits.

    Weerasekera, R., Grange, M., Pamunuwa, D. B. & Tenhunen, H., 03/2010, p. 1325-1328. 4 p.

    Research output: Contribution to conference - Without ISBN/ISSN › Conference paper › peer-review

  2. Published

    Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.

    Weerasekera, R., Grange, M., Pamunuwa, D. B., Tenhunen, H. & Zheng, L-R., 10/2009, Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  3. Published

    Switching sensitive driver circuit to combat dynamic delay in on-chip buses

    Weerasekera, R., Zheng, L-R., Pamunuwa, D. B., Tenhunen, H., Paliouras, V. (ed.), Vounckx, J. (ed.) & Verkest, D. (ed.), 09/2005, Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation: 15th International Workshop, PATMOS 2005, Leuven, Belgium, September 21-23, 2005. Proceedings. Paliouras, V., Vounckx, J. & Verkest, D. (eds.). Berlin: Springer, p. 277-285 9 p. (Lecture Notes in Computer Science; vol. 3728).

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  4. Published

    Amplitude stabilization and active control of a terahertz quantum cascade laser with a graphene loaded split-ring-resonator array

    Wei, B., Kindness, S., Almond, N., Wallis, R., Wu, Y., Ren, Y., Shi, S. C., Braeuninger-Weimer, P., Hofmann, S., Beere, H. E., Ritchie, D. & Degl'Innocenti, R., 15/05/2018, In: Applied Physics Letters. 112, 20, 4 p., 201102.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  5. Published

    Amplitude Stabilization of a Terahertz Quantum Cascade Laser with an External Metamaterial Amplitude Modulator

    Wei, B., Kindness, S., Almond, N., Wallis, R., Wu, Y., Ren, Y., Braeuninger-Weimer, P., Hofmann, S., Beere, HE., Ritchie, D. & Degl'Innocenti, R., 13/05/2018, CLEO: Science and Innovations 2018: Conference on Lasers and Electro-Optics OSA Technical Digest. USA: Optical Society of America (OSA), paper STu4D.5

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  6. Published

    Terahertz s-SNOM with >λ/1000 resolution based on self-mixing in quantum cascade lasers

    Wei, B., Wallis, R., Kindness, S., Mitrofanov, O., Beere, H. E., Ritchie, D. A. & Degl'Innocenti, R., 25/06/2017, The European Conference on Lasers and Electro-Optics, CLEO_Europe 2017. IEEE, 1 p. (Optics InfoBase Conference Papers; vol. Part F82-CLEO_Europe 2017).

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  7. Published

    Effect of phase transformation on mechanical properties of Al16.80Co20.74Cr20.49Fe21.28Ni20.70 high entropy alloy coatings processed by laser cladding

    Wei, X., Zhang, P., Yu, Z., Yan, H., Wu, D., Shi, H., Chen, J., Lu, Q., Tian, Y., Ma, S. & Lei, W., 5/05/2021, In: Journal of Alloys and Compounds. 862, 16 p., 158563.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  8. Published

    Scalability of Network-on-Chip communication architecture for 3-D meshes.

    Weldezion, A. Y., Grange, M., Pamunuwa, D. B., Lu, Z., Jantsch, A., Weerasekera, R. & Tenhunen, H., 12/06/2009, Proc. ACM/IEEE International Symposium on Networks on Chip (NOCS). San Diego: IEEE, p. 114-123 10 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  9. Published

    Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits.

    Weldezion, A., Weerasekera, R., Pamunuwa, D. B., Zheng, L-R. & Tenhunen, H., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  10. Published

    Mechanism-based modeling of solute strengthening: Application to thermal creep in Zr alloy

    Wen, W., Capolungo, L. & Tomé, C. N., 1/07/2018, In: International Journal of Plasticity. 106, p. 88-106 19 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

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